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Typical Thermal Characteristics
3.5
8
3
1a
7
1a
2.5
6
2
T A = 2 5 C
T A = 2 5 C
1.5
1
0.5
0
1b
1c
4.5"x5" FR-4 Board
o
Still Air
0.2 0.4 0.6 0.8
2oz COPPER MOUNTING PAD AREA (in 2 )
1
5
4
3
0
1b
1c
4.5"x5" FR-4 Board
o
Still Air
V G S = 1 0 V
0.2 0.4 0.6 0.8
2oz COPPER MOUNTING PAD AREA (in 2 )
1
Figure 12. SOT-223 Maximum Steady-State
Power Dissipation versus Copper
Mounting Pad Area.
Figure 13. Maximum Steady-State Drain Current
versus Copper Mounting Pad Area.
LIM
N)
S(
10
DC
0m
30
10
5
1
0.5
0.2
0.1
RD
IT
O
V GS = 1 0 V
SINGLE PULSE
10
1s
s
10
s
1m
ms
s
10
0u
s
= See Note 1c
0.05
R
θ J A
T A = 25°C
0.01
0.1
0.2
0.5
1
2
5
10
30
50
V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 14. Maximum Safe Operating Area.
1
0.5
D = 0.5
R JA = See Note 1 c
0.2
0.1
0.05
0.02
0.2
0.1
0.05
0.02
P(pk)
R θ JA (t) = r(t) * R θ JA
θ
0.01
0.01
t 1
t 2
T J - T A = P * R (t)
0.005
0.002
Single Pulse
θ JA
Duty Cycle, D = t 1 / t 2
0.001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 15. Transient Thermal Response Curve .
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDT451AN Rev. D1
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